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TE Connectivity 2013290-1

DDR3 SO-DIMM socket, 204 positions, 5.2 mm stack height, reverse keying, gold flash

TE Connectivity
Illustration of a TE Connectivity DDR3 SO-DIMM socket; not a photograph of 2013290-1

Image is for illustrative purposes only. Please refer to product description.

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What sets the 2013290-1 apart in the DDR3 SO-DIMM sockets family: mating plating gold Flash, stack height 5.2 mm [ .205 in ] and keying reverse Keying. The TE Connectivity 2013290-1 is a DDR3 SO-DIMM socket with 204 positions, 5.2 mm stack height, reverse keying, gold flash. Its 1.5 V memory interface and mechanical keying must match the memory module and board.

Manufacturer
TE Connectivity
Manufacturer part no.
2013290-1
Product family
DDR3 SO-DIMM Sockets
Type
DDR3 SO-DIMM socket
Category
Connectors and cables › Memory sockets and card connectors
Lifecycle
Active
OEM successor
Not stated
Technical datasheet
Data sheet

Technical specifications

Manufacturer
TE Connectivity
Manufacturer part no.
2013290-1
Type
DDR3 SO-DIMM socket
Application
Provides the board connection for a matching DDR3 SO-DIMM in compact computing or communications equipment. Confirm module voltage, keying and clearance.
Used with
DDR3 SO-DIMM memory module; exact drawing match required
Memory generation
DDR3
Positions
204
Keying
Reverse Keying
Mating plating
Gold Flash
PCB termination
Surface Mount
Module orientation
Right Angle
Housing color
Black
Packaging
Semi-Hard Tray Assembly
Stack height
5.2 mm [ .205 in ]
Pitch
.6 mm [ .024 in ]
Rows
2
Keys
1
DRAM voltage (V)
1.5
Ejector location
Both Ends
Ejector type
Locking
Module key position
SGRAM
Latch material
Stainless Steel
PCB termination plating
Gold
Contact material
Copper Alloy
Contact current max (A)
.5
PCB retention
Solder Peg
Housing material
High Temperature Thermoplastic
Row spacing
8.2 mm [ .322 in ]
Operating temperature
-55 – 85 °C [ -67 – 185 °F ]

Technical documents (1)

Key features

  • Positions: 204
  • PCB termination: Surface Mount
  • Stack height: 5.2 mm [ .205 in ]
  • Mating plating: Gold Flash
  • Keying: Reverse Keying

About the TE Connectivity 2013290-1

The TE Connectivity 2013290-1 is a DDR3 SO-DIMM socket with 204 positions, 5.2 mm stack height, reverse keying, gold flash. Its 1.5 V memory interface and mechanical keying must match the memory module and board.

What is the 2013290-1 used for?

Provides the board connection for a matching DDR3 SO-DIMM in compact computing or communications equipment. Confirm module voltage, keying and clearance.

Lifecycle and successor

Active.

Before you order

What to photograph or confirm so the right unit is quoted.

Confirm the complete TE part number, including all prefixes and suffixes. Send the mating card/module format, PCB drawing or footprint, and photos of the existing connector. Confirm height, keying, retention, plating and solder-tail/SMT geometry against the exact drawing. State quantity, packaging preference, required date and acceptable condition for the quotation.

Other parts in the TE Connectivity DDR3 SO-DIMM sockets family

Listed for reference. They differ from the 2013290-1 in rating, supply, interface or function and are not interchangeable with it unless TE Connectivity says so. Match the part number on your unit.

ProductTypeLifecycleQty AvailablePriceAction
TE Connectivity 2013287-3DDR3 SO-DIMM socket, 204 positions, 4.0 mm height, reverse keying, gold (30)DDR3 SO-DIMM socketTo be confirmedIn stockOn requestView
TE Connectivity 2013297-1DDR3 SO-DIMM socket, 204 positions, 8.0 mm height, standard keying, gold flashDDR3 SO-DIMM socketTo be confirmedIn stockOn requestView
TE Connectivity 2013297-2DDR3 SO-DIMM socket, 204 positions, 8.0 mm height, standard keying, gold (10)DDR3 SO-DIMM socketTo be confirmedIn stockOn requestView
TE Connectivity 2013297-3DDR3 SO-DIMM socket, 204 positions, 8.0 mm height, standard keying, gold (30)DDR3 SO-DIMM socketTo be confirmedIn stockOn requestView
TE Connectivity 2013298-1DDR3 SO-DIMM socket, 204 positions, 8.0 mm height, reverse keying, gold flashDDR3 SO-DIMM socketTo be confirmedIn stockOn requestView
TE Connectivity 2013298-2DDR3 SO-DIMM socket, 204 positions, 8.0 mm height, reverse keying, gold (10)DDR3 SO-DIMM socketTo be confirmedIn stockOn requestView
TE Connectivity 2013298-3DDR3 SO-DIMM socket, 204 positions, 8.0 mm height, reverse keying, gold (30)DDR3 SO-DIMM socketTo be confirmedIn stockOn requestView
TE Connectivity 2013289-1DDR3 SO-DIMM socket, 204 positions, 5.2 mm stack height, standard keying, gold flashDDR3 SO-DIMM socketActiveIn stockOn requestView
TE Connectivity 2013289-2DDR3 SO-DIMM socket, 204 positions, 5.2 mm stack height, standard keying, 10 µin goldDDR3 SO-DIMM socketActiveIn stockOn requestView
TE Connectivity 2013289-3DDR3 SO-DIMM socket, 204 positions, 5.2 mm stack height, standard keying, 30 µin goldDDR3 SO-DIMM socketDiscontinuedIn stockOn requestView
TE Connectivity 2013290-2DDR3 SO-DIMM socket, 204 positions, 5.2 mm stack height, reverse keying, 10 µin goldDDR3 SO-DIMM socketActiveIn stockOn requestView
TE Connectivity 2013290-3DDR3 SO-DIMM socket, 204 positions, 5.2 mm stack height, reverse keying, 30 µin goldDDR3 SO-DIMM socketDiscontinuedIn stockOn requestView

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