TE Connectivity 1-1473005-1
TE Connectivity
DDR1 SO-DIMM socket, 200 positions, 5.2 mm stack height, standard keying
DIMM, SO-DIMM and SIMM sockets and SD, microSD, CompactFlash and SIM card connectors, by memory generation, position count and height.
Products 1-24 of 300
TE Connectivity
DDR1 SO-DIMM socket, 200 positions, 5.2 mm stack height, standard keying
TE Connectivity
DDR SO-DIMM socket (generation unresolved): 200 positions, 5.2 mm [ .205 in ] stack height, Semi-Hard Tray Assembly packaging
TE Connectivity
DDR1 SO-DIMM socket: 200 positions, Surface Mount, 5.2 mm [ .205 in ] stack height, Right Angle, Gold Flash, Semi-Hard Tray Assembly
TE Connectivity
DDR SO-DIMM socket (generation unresolved): 200 positions, Surface Mount, 6.5 mm [ .256 in ] stack height, Right Angle, Gold Flash, Semi-Hard Tray Assembly
TE Connectivity
Mini SIM card connector, 6 positions, 5 Directional, 1.5 mm profile
TE Connectivity
SIM card connector: 6 positions, Surface Mount, 2FF Mini SIM, Tape & Reel
TE Connectivity
SIM card connector: 6 positions, Surface Mount, 2FF Mini SIM, Tape & Reel
TE Connectivity
CompactFlash connector: 50 positions, Surface Mount, Gold (Au), Box & Tray | Tray
TE Connectivity
DDR2 SO-DIMM socket: 144 positions, 5.2 mm [ .205 in ] stack height, Tape & Reel packaging
TE Connectivity
DDR3 SO-DIMM socket: 144 positions, Surface Mount, 5.2 mm [ .205 in ] stack height, Right Angle, Gold (Au), Tape & Reel
TE Connectivity
SD card connector: 9 positions, Surface Mount, Secure Digital
TE Connectivity
DDR3 DIMM socket: 240 positions, Through Hole - Solder, Vertical, Gold (Au), Tray
TE Connectivity
DDR3 DIMM socket: 240 positions, Through Hole - Solder, Vertical, Gold (Au), Tray
TE Connectivity
DDR3 DIMM socket: 240 positions, Through Hole - Solder, Vertical, Gold Flash, Tray
TE Connectivity
DDR3 DIMM socket: 240 positions, Through Hole - Solder, Vertical, Gold (Au), Tray
TE Connectivity
DDR3 DIMM socket, 240 positions, through-hole mounting, 2.67 mm solder tail, black housing
TE Connectivity
DDR3 DIMM socket, 240 positions, vertical through-hole solder, 3.18 mm tails, black housing
TE Connectivity
DDR3 DIMM socket: 240 positions, Through Hole - Solder, Vertical, Gold (Au), Box & Tray | Tray
TE Connectivity
DDR3 DIMM socket, 240 positions, vertical through-hole solder, 4.00 mm tails, black housing
TE Connectivity
DDR3 DIMM socket, 240 positions, vertical through-hole solder, 2.67 mm tails, black housing
TE Connectivity
DDR3 DIMM socket: 240 positions, Through Hole - Solder, Vertical, Gold (Au), Tray
TE Connectivity
DDR3 DIMM socket: 240 positions, Surface Mount, Vertical, Gold (Au), Box & Tray | Tray
TE Connectivity
DDR4 DIMM socket, 288 positions, through-hole solder, long latch, 15 µin gold, 2.1 mm tails
TE Connectivity
DDR4 DIMM socket, 288 positions, through-hole solder, long latch, 30 µin gold, 2.67 mm tails
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