TE Connectivity 2309411-3

DDR4 SO-DIMM socket, 260 positions, 8 mm stack height, standard keying, 10 µin gold

Illustration of a TE Connectivity DDR4 SO-DIMM socket; not a photograph of 2309411-3

Image is for illustrative purposes only. Please refer to product description.

Delivery options

What sets the 2309411-3 apart in the DDR4 SO-DIMM sockets family: mating plating thickness .254 µm [ 10 µin ], stack height 8 mm [ .315 in ] and keying standard Keying. The TE Connectivity 2309411-3 is a DDR4 SO-DIMM socket with 260 positions, 8 mm stack height, standard keying, 10 µin gold. Its 1.2 V memory interface and mechanical keying must match the memory module and board.

Manufacturer: TE Connectivity
Manufacturer part no.: 2309411-3
Product family: DDR4 SO-DIMM Sockets
Type: DDR4 SO-DIMM socket
Category: Connectors and cables › Memory sockets and card connectors
Lifecycle: Active
OEM successor: Not stated
Technical datasheet: Data sheet

Technical specifications

Manufacturer: TE Connectivity
Manufacturer part no.: 2309411-3
Type: DDR4 SO-DIMM socket
Application: Provides the board connection for a matching DDR4 SO-DIMM in compact computing or communications equipment. Confirm module voltage, keying and clearance.
Used with: DDR4 SO-DIMM memory module; exact drawing match required
Memory generation: DDR4
Positions: 260
Pitch: .5 mm [ .02 in ]
Keying: Standard Keying
Mating plating: Gold (Au)
PCB termination: Surface Mount
Module orientation: Right Angle
Packaging: Tape & Reel
Stack height: 8 mm [ .315 in ]
Rows: 2
Keys: 1
DRAM voltage (V): 1.2
Ejector location: Both Ends
Ejector type: Locking
Module key position: Offset Left
Latch material: High Temperature Thermoplastic
Retention post location: Both Ends
PCB termination plating: Gold Flash
Contact material: Copper Alloy
Underplating: Nickel
Contact current max (A): .5
Mating plating thickness: .254 µm [ 10 µin ]
PCB retention: Solder Peg
Housing material: High Temperature Thermoplastic
Housing color: Black

Show all 32 specifications

Row spacing: 8.2 mm [ .322 in ]
Operating temperature: -55 – 85 °C [ -67 – 185 °F ]

Technical documents (1)

TE Connectivity product page 2309411-3, Identity, lifecycle, Features and Documents

Key features

Positions: 260
PCB termination: Surface Mount
Stack height: 8 mm [ .315 in ]
Mating plating: Gold (Au)
Keying: Standard Keying

About the TE Connectivity 2309411-3

The TE Connectivity 2309411-3 is a DDR4 SO-DIMM socket with 260 positions, 8 mm stack height, standard keying, 10 µin gold. Its 1.2 V memory interface and mechanical keying must match the memory module and board.

What is the 2309411-3 used for?

Provides the board connection for a matching DDR4 SO-DIMM in compact computing or communications equipment. Confirm module voltage, keying and clearance.

Lifecycle and successor

Active.

Before you order

What to photograph or confirm so the right unit is quoted.

Confirm the complete TE part number, including all prefixes and suffixes. Send the mating card/module format, PCB drawing or footprint, and photos of the existing connector. Confirm height, keying, retention, plating and solder-tail/SMT geometry against the exact drawing. State quantity, packaging preference, required date and acceptable condition for the quotation.

Other parts in the TE Connectivity DDR4 SO-DIMM sockets family

Listed for reference. They differ from the 2309411-3 in rating, supply, interface or function and are not interchangeable with it unless TE Connectivity says so. Match the part number on your unit.

Product	Type	Lifecycle	Qty Available	Price	Action
TE Connectivity 2309410-2DDR4 SO-DIMM socket, 260 positions, 5.2 mm stack height, reverse keying, 5 µin gold	DDR4 SO-DIMM socket	Active	In stock	On request	View
TE Connectivity 2309410-3DDR4 SO-DIMM socket, 260 positions, 5.2 mm stack height, reverse keying, 10 µin gold	DDR4 SO-DIMM socket	Active	In stock	On request	View
TE Connectivity 2309410-4DDR4 SO-DIMM socket, 260 positions, 5.2 mm stack height, reverse keying, 15 µin gold	DDR4 SO-DIMM socket	Active	In stock	On request	View
TE Connectivity 2309410-5DDR4 SO-DIMM socket, 260 positions, 5.2 mm stack height, reverse keying, 30 µin gold	DDR4 SO-DIMM socket	Active	In stock	On request	View
TE Connectivity 2309411-1DDR4 SO-DIMM socket, 260 positions, 8 mm stack height, standard keying, gold flash	DDR4 SO-DIMM socket	Active	In stock	On request	View
TE Connectivity 2309411-2DDR4 SO-DIMM socket, 260 positions, 8 mm stack height, standard keying, 5 µin gold	DDR4 SO-DIMM socket	Active	In stock	On request	View
TE Connectivity 2309411-4DDR4 SO-DIMM socket, 260 positions, 8 mm stack height, standard keying, 15 µin gold	DDR4 SO-DIMM socket	Active	In stock	On request	View
TE Connectivity 2309411-5DDR4 SO-DIMM socket, 260 positions, 8 mm stack height, standard keying, 30 µin gold	DDR4 SO-DIMM socket	Active	In stock	On request	View
TE Connectivity 2309412-1DDR4 SO-DIMM socket, 260 positions, 8 mm stack height, reverse keying, gold flash	DDR4 SO-DIMM socket	Active	In stock	On request	View
TE Connectivity 2309412-2DDR4 SO-DIMM socket, 260 positions, 8 mm stack height, reverse keying, 5 µin gold	DDR4 SO-DIMM socket	Active	In stock	On request	View
TE Connectivity 2309412-3DDR4 SO-DIMM socket, 260 positions, 8 mm stack height, reverse keying, 10 µin gold	DDR4 SO-DIMM socket	Active	In stock	On request	View
TE Connectivity 2309412-4DDR4 SO-DIMM socket, 260 positions, 8 mm stack height, reverse keying, 15 µin gold	DDR4 SO-DIMM socket	Active	In stock	On request	View

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