TE Connectivity 1-1735251-3

DDR3 SO-DIMM socket: 144 positions, Surface Mount, 5.2 mm [ .205 in ] stack height, Right Angle, Gold (Au), Tape & Reel

Illustration of a TE Connectivity DDR3 SO-DIMM socket; not a photograph of 1-1735251-3

Image is for illustrative purposes only. Please refer to product description.

Delivery options

What sets the 1-1735251-3 apart in the DDR3 SO-DIMM sockets family: mating plating thickness .25 µm [ 9.84 µin ], PCB retention hold-Down Post and DRAM voltage (V) 1.8. The TE Connectivity 1-1735251-3 is a DDR3 SO-DIMM socket. The individual manufacturer record specifies 144 positions, Surface Mount, 5.2 mm [ .205 in ] stack height, Right Angle, Gold (Au), Tape & Reel. Check the exact drawing for PCB footprint, keying, contact layout and mechanical clearance.

Manufacturer: TE Connectivity
Manufacturer part no.: 1-1735251-3
Product family: DDR3 SO-DIMM Sockets
Type: DDR3 SO-DIMM socket
Category: Connectors and cables › Memory sockets and card connectors
Lifecycle: Active
OEM successor: Not stated
Technical datasheet: Data sheet

Technical specifications

Manufacturer: TE Connectivity
Manufacturer part no.: 1-1735251-3
Type: DDR3 SO-DIMM socket
Application: Provides the board connection for a matching removable memory module in computing or embedded equipment. Position count, memory standard and mechanical key must match.
Used with: DDR3 SO-DIMM socket; exact drawing match required
DRAM type: Double Data Rate (DDR) 3
Stack height: 5.2 mm [ .205 in ]
Module orientation: Right Angle
Positions: 144
Pitch: .8 mm [ .031 in ]
Rows: 2
Keys: 1
DRAM voltage (V): 1.8
Ejector location: Both Ends
Ejector type: Locking
Module key position: SGRAM
Latch material: Stainless Steel
PCB termination plating: Gold
Contact material: Copper Alloy
Mating plating: Gold (Au)
Mating plating thickness: .25 µm [ 9.84 µin ]
PCB termination: Surface Mount
Keying: Standard Keying
PCB retention: Hold-Down Post
Housing material: High Temperature Thermoplastic
Housing color: Black
Row spacing: 6.2 mm [ .244 in ]
Operating temperature: -55 – 105 °C [ -67 – 221 °F ]
Packaging: Tape & Reel

Technical documents (1)

TE Connectivity product page 1-1735251-3, Documents tab; exact part revision must be checked

Key features

Positions: 144
PCB termination: Surface Mount
Stack height: 5.2 mm [ .205 in ]
Module orientation: Right Angle
Mating plating: Gold (Au)
Packaging: Tape & Reel

About the TE Connectivity 1-1735251-3

The TE Connectivity 1-1735251-3 is a DDR3 SO-DIMM socket. The individual manufacturer record specifies 144 positions, Surface Mount, 5.2 mm [ .205 in ] stack height, Right Angle, Gold (Au), Tape & Reel. Check the exact drawing for PCB footprint, keying, contact layout and mechanical clearance.

What is the 1-1735251-3 used for?

Provides the board connection for a matching removable memory module in computing or embedded equipment. Position count, memory standard and mechanical key must match.

Lifecycle and successor

Active.

Before you order

What to photograph or confirm so the right unit is quoted.

Provide the complete TE part number, required quantity and packaging. Confirm the exact PCB footprint, contact plating, keying and module or card standard. Confirm lifecycle, stock, condition and lead time separately at quotation.

Other parts in the TE Connectivity DDR3 SO-DIMM sockets family

Listed for reference. They differ from the 1-1735251-3 in rating, supply, interface or function and are not interchangeable with it unless TE Connectivity says so. Match the part number on your unit.

Product	Type	Lifecycle	Qty Available	Price	Action
TE Connectivity 2-2013297-1DDR3 SO-DIMM socket: 204 positions, 8 mm [ .315 in ] stack height, Emboss on Reel packaging	DDR3 SO-DIMM socket	Active	In stock	On request	View
TE Connectivity 2-2013297-2DDR3 SO-DIMM socket: 204 positions, 8.0 mm stack height, Reel packaging	DDR3 SO-DIMM socket	To be confirmed	In stock	On request	View
TE Connectivity 2-2013297-3DDR3 SO-DIMM socket: 204 positions, 8 mm [ .315 in ] stack height, Emboss on Reel packaging	DDR3 SO-DIMM socket	Active	In stock	On request	View
TE Connectivity 2-2013298-1DDR3 SO-DIMM socket: 204 positions, 8 mm [ .315 in ] stack height, Emboss on Reel packaging	DDR3 SO-DIMM socket	Active	In stock	On request	View
TE Connectivity 2-2013298-2DDR3 SO-DIMM socket: 204 positions, 8.0 mm stack height, Reel packaging	DDR3 SO-DIMM socket	To be confirmed	In stock	On request	View
TE Connectivity 2-2013298-3DDR3 SO-DIMM socket: 204 positions, 8 mm [ .315 in ] stack height, Emboss on Reel packaging	DDR3 SO-DIMM socket	Active	In stock	On request	View
TE Connectivity 2-2013310-1DDR3 SO-DIMM socket: 204 positions, 9.2 mm [ .362 in ] stack height, Emboss on Reel packaging	DDR3 SO-DIMM socket	Active	In stock	On request	View
TE Connectivity 2-2013310-2DDR3 SO-DIMM socket: 204 positions, 9.2 mm [ .362 in ] stack height, Emboss on Reel packaging	DDR3 SO-DIMM socket	Active	In stock	On request	View
TE Connectivity 2-2013310-3DDR3 SO-DIMM socket: 204 positions, 9.2 mm [ .362 in ] stack height, Emboss on Reel packaging	DDR3 SO-DIMM socket	Discontinued	In stock	On request	View
TE Connectivity 2-2013311-1DDR3 SO-DIMM socket: 204 positions, 9.2 mm [ .362 in ] stack height, Emboss on Reel packaging	DDR3 SO-DIMM socket	Active	In stock	On request	View
TE Connectivity 2-2013311-2DDR3 SO-DIMM socket: 204 positions, 9.2 mm stack height, Reel packaging	DDR3 SO-DIMM socket	To be confirmed	In stock	On request	View
TE Connectivity 2-2013311-3DDR3 SO-DIMM socket: 204 positions, 9.2 mm [ .362 in ] stack height, Emboss on Reel packaging	DDR3 SO-DIMM socket	To be confirmed	In stock	On request	View

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