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TE Connectivity 1888669-1

DDR2 DIMM socket: 240 positions, Through Hole - Solder, Vertical, Gold (Au), Box & Tray | Tray

TE Connectivity
Illustration of a TE Connectivity DDR2 DIMM socket; not a photograph of 1888669-1

Image is for illustrative purposes only. Please refer to product description.

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What sets the 1888669-1 apart in the DDR2 and earlier DIMM and SO-DIMM sockets family: DRAM type double Data Rate (DDR) 2 (Low Profile), latch material high Temperature Thermoplastic and PCB termination through Hole - Solder. The TE Connectivity 1888669-1 is a DDR2 DIMM socket. The individual manufacturer record specifies 240 positions, Through Hole - Solder, Vertical, Gold (Au), Box & Tray | Tray. Check the exact drawing for PCB footprint, keying, contact layout and mechanical clearance.

Manufacturer
TE Connectivity
Manufacturer part no.
1888669-1
Product family
DDR2, DDR and SDRAM DIMM and SO-DIMM Sockets
Type
DDR2 DIMM socket
Category
Connectors and cables › Memory sockets and card connectors
Lifecycle
Discontinued
OEM successor
Not stated
Technical datasheet
Data sheet

Technical specifications

Manufacturer
TE Connectivity
Manufacturer part no.
1888669-1
Type
DDR2 DIMM socket
Application
Provides the board connection for a matching removable memory module in computing or embedded equipment. Position count, memory standard and mechanical key must match.
Used with
DDR2 DIMM socket; exact drawing match required
DRAM type
Double Data Rate (DDR) 2 (Low Profile)
Positions
240
PCB termination
Through Hole - Solder
Module orientation
Vertical
Rows
2
Keys
1
DRAM voltage (V)
1.8
Ejector location
Both Ends
Module key position
Offset Right
Latch material
High Temperature Thermoplastic
Latch color
Natural
Retention post location
Both Ends
Ejector type
Locking
PCB termination plating
Tin
Contact material
Copper Alloy
Mating plating
Gold (Au)
Mating plating thickness
.76 µm [ 30 µin ]
Underplating
Nickel
Contact current max (A)
.5
Keying
Center
PCB retention
Boardlock
Housing material
High Temperature Thermoplastic
Housing color
Black
Pitch
1 mm [ .039 in ]
Row spacing
1.9 mm [ .075 in ]
Show all 31 specifications
Packaging
Box & Tray | Tray

Technical documents (1)

Key features

  • Positions: 240
  • PCB termination: Through Hole - Solder
  • Module orientation: Vertical
  • Mating plating: Gold (Au)
  • Packaging: Box & Tray | Tray

About the TE Connectivity 1888669-1

The TE Connectivity 1888669-1 is a DDR2 DIMM socket. The individual manufacturer record specifies 240 positions, Through Hole - Solder, Vertical, Gold (Au), Box & Tray | Tray. Check the exact drawing for PCB footprint, keying, contact layout and mechanical clearance.

What is the 1888669-1 used for?

Provides the board connection for a matching removable memory module in computing or embedded equipment. Position count, memory standard and mechanical key must match.

Lifecycle and successor

Discontinued.

Before you order

What to photograph or confirm so the right unit is quoted.

Provide the complete TE part number, required quantity and packaging. Confirm the exact PCB footprint, contact plating, keying and module or card standard. Confirm lifecycle, stock, condition and lead time separately at quotation.

Other parts in the TE Connectivity DDR2 and earlier DIMM and SO-DIMM sockets family

Listed for reference. They differ from the 1888669-1 in rating, supply, interface or function and are not interchangeable with it unless TE Connectivity says so. Match the part number on your unit.

ProductTypeLifecycleQty AvailablePriceAction
TE Connectivity 1888669-5DDR2 DIMM socket: 240 positions, Box & Tray | Tray packagingDDR2 DIMM socketTo be confirmedIn stockOn requestView
TE Connectivity 1827236-4DDR2 SO-DIMM socket: 200 positions, 4.6 mm [ .18 in ] stack height, Box | Tray packagingDDR2 SO-DIMM socketActiveIn stockOn requestView
TE Connectivity 1827341-4DDR2 SO-DIMM socket: 200 positions, 8 mm [ .315 in ] stack height, Box | Tray packagingDDR2 SO-DIMM socketActiveIn stockOn requestView
TE Connectivity 1612618-1DDR1 SO-DIMM socket: 200 positions, 9.2 mm [ .362 in ] stack height, Semi-Hard Tray Assembly packagingDDR1 SO-DIMM socketActiveIn stockOn requestView
TE Connectivity 1717468-3DDR1 SO-DIMM socket: 200 positions, 6.5 mm [ .256 in ] stack height, Semi-Hard Tray Assembly | Tray packagingDDR1 SO-DIMM socketActiveIn stockOn requestView
TE Connectivity 1612923-1DDR1 SO-DIMM socket: 200 positions, 5.2 mm [ .205 in ] stack height, Semi-Hard Tray Assembly | Tray packagingDDR1 SO-DIMM socketDiscontinuedIn stockOn requestView
TE Connectivity 1473006-4DDR2 SO-DIMM socket: 200 positions, 5.2 mm [ .205 in ] stack height, Right Angle, Gold FlashDDR2 SO-DIMM socketActiveIn stockOn requestView
TE Connectivity 1-1473006-1DDR1 SO-DIMM socket: 200 positions, Surface Mount, 5.2 mm [ .205 in ] stack height, Right Angle, Gold Flash, Semi-Hard Tray AssemblyDDR1 SO-DIMM socketDiscontinuedIn stockOn requestView
TE Connectivity 1939495-1DDR2 DIMM socket: 240 positions, Surface Mount, Vertical, Gold (Au), Box & Tray | TrayDDR2 DIMM socketDiscontinuedIn stockOn requestView
TE Connectivity 1-1612773-4DDR SO-DIMM socket (generation unresolved): 200 positions, Surface Mount, 6.5 mm [ .256 in ] stack height, Right Angle, Gold Flash, Semi-Hard Tray AssemblyDDR SO-DIMM socket (generation unresolved)DiscontinuedIn stockOn requestView
TE Connectivity 1717379-1DDR1 SO-DIMM socket: 200 positions, Surface Mount, 5.2 mm [ .205 in ] stack height, Right Angle, Gold Flash, Tape & ReelDDR1 SO-DIMM socketDiscontinuedIn stockOn requestView
TE Connectivity 1717379-4DDR2 SO-DIMM socket: 200 positions, Surface Mount, 5.2 mm [ .205 in ] stack height, Right Angle, Gold Flash, Tape & ReelDDR2 SO-DIMM socketDiscontinuedIn stockOn requestView

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